| Technical Data | |
| Material： | |
| Pin： | Copper Alloy |
| Plating： | "Ni, 40-80μ" min |
| Contact Plated： | Gold Flash |
| Insulator (housing)： | Nylon(UL94-0)/Nature or others |
| Electrical： | |
| Operating temperature： | Gold Plated：-55°C to +170°C |
| Tin plated：-40°C to +170°C | |
| Soldering temperature： | +260°C, 10s max |
| Plastic Housing : | 170 °C |
| Mechanical life cycles： | Min 5000. |
| APPLlCABLE TO CAN | |
| Lead in diameter： | φ0.25mm/0.0098"- φ0.35mm/0.0138" |
| Pitch circle DIA： | φ2.20mm |
| Lead length： | Min 8.0～10mm |
UT-TO565S25G
DETAIL