| Technical Data | |
| Material： | |
| Pin： | Copper Alloy |
| Tin plated： | 2μm/80μ"Ni, 5μ/200μ"Sn |
| Gold plated： | 2μm/80μ"nickelfull gold |
| Insulator black(housing)： | LCP (UL94V-0) |
| Electrical： | |
| Operating temperature： | Gold Plated：-55°C to +200°C |
| Tin plated：-40°C to +200°C | |
| Soldering temperature： | +260°C, 10s max |
| Mechanicalf life cycle： | Min. 5000 |
| Temperature range： | -40°C to +200°C |
| APPLlCABLE TO CAN | |
| Lead in diameter： | φ0.45mm/0.0177" |
| Pitch circle DIA： | φ2.0mm |
| Lead length： | Min 10～12mm |
UT-TO564S10G
DETAIL